Dr. Elke Erben

technology development integration bei GLOBALFOUNDRIES


technology development integration
January 2011 - Present

Namlab GmbH
Educational Institution; Semiconductors
July 2009 - December 2010

development low temperature high-k ALD process thin film characterization methods (physical and electrical characterization) set up MIS and MIM characterization routes within Namlab and TU Dresden/ IHM project creation and aquisation with industrial and R&D partners

senior engineer process development films
Infineon/ Qimonda Dresden
2002 - 2009

high-k ALD material and process development in R&D mode and in production transfer R&D processes to production unit process development methodology (DOE)

scientist/ process development
center for microtechnologies @ TU Chemnitz
1987 - 1991

CVD process development SiO2, Si3N4 and high-k materials Al2O3, Ta2O5


Technische Universitt Chemnitz
Physik, Mathematik, solid state physics, thin film characterization

Patents (6)

Methods for fabricating integrated circuits with fluorine passivation
Dina Triyoso, Elke Erben, Robert Binder
July 29, 2014: 08791003

Passivating point defects in high-K gate dielectric layers during gate stack formation
Elke Erben, Martin Trentzsch, Richard J Carter
February 25, 2014: 08658490

Methods for fabricating integrated circuits with narrow, metal filled openings
Sven Schmidbauer, Dina H Triyoso, Elke Erben, Hao Zhang, Robert Binder
February 18, 2014: 08652890

Deposition method for a transition-metal-containing dielectric (7 worldwide citation)
Stephan Kudelka, Lars Oberbeck, Uwe Schroeder, Tim Boescke, Johannes Heitmann, Annette Saenger, Joerg Schumann, Elke Erben
February 23, 2010: 07666752