Belgacem Haba

Tessera Fellow and CTO
Semiconductors

Experience

Tessera Fellow and CTO
tessera
Public Company; Semiconductors
November 1996 - Present

Patents (525)

Through interposer wire bond using low CTE interposer with coarse slot apertures
Simon McElrea, Wael Zohni, Belgacem Haba
October 28, 2014: 08872318

Stacked multi-die packages with impedance control
Belgacem Haba
October 7, 2014: 08853708

Co-support component and microelectronic assembly
Richard Dewitt Crisp, Belgacem Haba, Wael Zohni
September 30, 2014: 08848391

Co-support module and microelectronic assembly
Richard Dewitt Crisp, Belgacem Haba, Wael Zohni
September 30, 2014: 08848392

Microelectronic assembly with thermally and electrically conductive underfill
Belgacem Haba, Simon McElrea
September 30, 2014: 08847412

Staged via formation from both sides of chip
Vage Oganesian, Belgacem Haba, Ilyas Mohammed, Craig Mitchell, Piyush Savalia
September 30, 2014: 08847380

Microelectronic elements with post-assembly planarization (4 worldwide citation)
Vage Oganesian, Belgacem Haba, Craig Mitchell, Ilyas Mohammed, Piyush Savalia
September 30, 2014: 08847376

Three-dimensional system-in-a-package (1 worldwide citation)
Vage Oganesian, Belgacem Haba, Ilyas Mohammed, Piyush Savalia, Craig Mitchell
September 23, 2014: 08841763

Multi-chip module with stacked face-down connected dies (4 worldwide citation)
Belgacem Haba, Ilyas Mohammed, Piyush Savalia
September 23, 2014: 08841765

Chip assembly having via interconnects joined by plating
Vage Oganesian, Belgacem Haba, Ilyas Mohammed, Craig Mitchell, Piyush Savalia
September 16, 2014: 08835223

Connections (259)
Victor Liew
director at Aptina Imaging

Ali Benmoussa
CEO at Ticketwood.com

Nadim Maluf
CEO at Qnovo Corp.